This thermal pad by Delock is suitable for heat dissipation, for example on an M.2 module. The aim of the pad is to improvethe performanceandincreasethe service life of thecomponents.

Technical data
– Thermal conductive pad for heat dissipation
– Thermal conductivity: 3.0 W/mK
– Operating temperature: -60 °C ~ 180 °C
– Colour: grey
– Dimensions (LxWxH): approx. 70 x 20 x 0.75 mm

Package contents
– 1 x thermal conductive pad

Packaging
– Resealable bag