Delock – 18479 – Delock thermal pad 70 x 20 x 0.75 mm for M.2 modules 3.0 WmK – Silicone free

This thermal pad by Delock is suitable for heat dissipation, for example on an M.2 module. The aim of the pad is to improvethe performanceandincreasethe service life of thecomponents. Typical areas of application for silicone-free padscan be found in industry and optoelectronics.

Silicone-free Silicone-free pads do not release any oils that could contaminate or damage sensitive components. This makes them ideal for sensitive electronics, such as sensors. In addition, silicone-free pads can be used in a wider temperature range without compromising their properties, which is particularly usefulin industrial applications with extreme temperatures. In addition to the advantage of longer durability, they are also more environmentally friendly thanconventional thermal pads.

Technical data
– Thermal conductive pad for heat dissipation
– Thermal conductivity: 3.0 W/mK
– Operating temperature: -60 °C ~ 180 °C
– Colour: pink
– – Dimensions (LxWxH): approx. 70 x 20 x 0.75 mm

Package contents
– 1 x thermal conductive pad

Packaging
– Resealable bag