UPS-APLX7F-A20-0864 – UP Squared Developer Board, Intel Atom E3950 (F1), 8 GB Memory, 64 GB

478,37 

UPS-APLX7F-A20-0864 – UP Squared Developer Board with Intel(R) Atom(TM) E3950 (F1), 8 GB Memory, 64 GB eMMC UP Squared (UP2) is the world’s fastest maker board with the high performance and low power consumption features of Intel(R) Celeron(TM),…

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SKU UPS-APLX7F-A20-0864
EAN 4251876896464
MPN UPS-APLX7F-A20-0864
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UPS-APLX7F-A20-0864 – UP Squared Developer Board with Intel(R) Atom(TM) E3950 (F1), 8 GB Memory, 64 GB eMMC

UP Squared (UP2) is the world’s fastest maker board with the high performance and low power consumption features of Intel(R) Celeron(TM), Pentium(TM) and Atom(TM) processors (codename Apollo Lake).

The internal GPU is the new Intel(R) Generation 9 HD, supporting 4K Codec Decode and Encode for HEVC4, H.264 and VP8. Thanks to the Vector Units Image Processing Unit and Precision Timing Management to synchronize CPU with I/O, improved determinism (cache QoS, Intel Virtualization Technology), all the graphic processing is effortless to UP Squared.

UP Squared comes with 8 GB LPDDR4 and 64 GB eMMC. A 40-pin GP-bus provides the freedom for makers to build up their module. Additionally, there is a 60-pin EXHAT for embedded applications. This allows for the exploration of more possibilities. The expansion capabilities of UP2 (UP Squared) goes much further than this. Native mini-PCI-e, M.2 2230 and SATA3 are all built in on the board.

UP Squared supports the AI Core X mPCIe module, which features Intel Movidius Myriad X. With speeds up to 105 fps (80 typical) and 1 trillion floating point operations, adding on the AI Core X to UP Squared creates a powerful, compact AI Edge solution. UP Squared with AI Core X has proven real-world performance, used by AAEON partners in applications from license plate recognition to drone-based visual inspections.

The board supports Windows 10, Windows IoT Core, Ubilinux, Ubuntu, Yocto and Android Nougat. It’s really UP to you to decide which operating system is best for your application. Now, all you need is an UP Squared to begin your project!

  • Processor: Intel(R) Atom(TM) E3950 processor SoC
  • Graphics: Intel(R) Gen 9 HD, supporting 4K Codec decode and encode for HEVC4, H.264, VP8
  • I/O: 1x HDMI; 1x DP; I2S audio port
  • Camera: CSI 2-lane + CSI 4-lane
  • USB: 2x USB 2.0; 1x USB 3.0 OTG; 3x USB 3.0 (type A)
  • Expansion: 1x 40-pin GPIO; 1x Mini-PCIe; 1x M.2 2230; 1x SATA3; 1x 60-pin EXHAT
  • RTC: Yes
  • Power: 5 V DC-in (at) 4 -6 A
  • Dimension: 3.37″ x 3.54″ (85.6 x 90 mm)
  • Memory: 8 GB (dual channel) LPDDR4
  • Storage: eMMC 64 GB
  • Display interface: eDP
  • Ethernet: 2x Gb Ethernet (full speed) RJ-45
  • OS support: Microsoft Windows 10 (full), Windows IOT Core, Linux (ubilinux, Ubuntu, Yocto), Android Nougat
  • Operating Temperature: 32°F ~ 140°F (0°C ~ 60°C)
  • Operating humidity: 0% ~ 90% relative humidity, non-condensing
  • Certificate: CE/FCC class A, RoHS compliant, REACH
Weight 0,3 kg
Dimensions 13 × 13 × 6 cm
Chipset

Intel

Bluetooth

no

Memory size

64GB

memory type

LPDDR4

graphic card

Intel Gen 9 HD

processor

Intel Atom x7-E3950

hard drive typ

eMMC

scope of application

IoT

Connections

HDMI, RJ45, USB

type of cooling

air cooling passiv

Produkttyp

SBC / Single board Computer

Color

green

memory size

8 GB

number of hard drives installed

1

memory configuration

2 x 4GB

operating system

Ohne Betriebssystem

number of CPU cores

4

processor clock speed

1.9GHz

garaphocs memory type

shared-memory

Product safety

Manufacturer information

AAEON Technology (Europe) B.V.
Beatrix de Rijkweg 8
5657 EG Eindhoven
NL - Netherlands

E-Mail: shop@up-board.org

Person responsible for the EU

AAEON Technology (Europe) B.V.
Beatrix de Rijkweg 8
5657 EG Eindhoven
NL - Netherlands

E-Mail: shop@up-board.org

UP – Bridge the Gap is a brand that provides innovative and reliable Single-board computers (SBCs) for professional developers with the latest Intel® technology, helping them to bring their ideas to fruition. The UP team aims to bring innovation through integrated solutions for a variety of business models. Working closely with leaders across vertical markets,...