UP Bundle with Board (4 GB RAM/64 GB eMMC), Plastic Case, Power Adapter

UP Bundle with Board (4 GB RAM/64 GB eMMC), Plastic Case, Power Adapter

The UP board with x5-Z8350 CPU, 64 GB eMMC, 4 GB RAM, plastic case and power adapter.

UP unleashes the power of the Intel x5-Z8350 Quad Core 1.44 GHz (1.92 GHz) 64-bit 2W SDP CPU.

The 40 pin I/O connector, the USB 3.0 OTG, the Gigabit Ethernet, the HDMI and more other features make it a perfect solution for different domains and products like Robotics, Drone, Machine Vision, Smart Home, Education, Digital Signage, Intelligent Cars, or Internet Of Things. The compatibility with Linux, Android, and all the Windows 10 distributions give you great flexibility, scalability and quick time to market.

Offered is one UP board featuring the x5-Z8350 CPU with 64 GB eMMC & 4 GB RAM on board.

Bundle contents:

• UP board
• Heatsink
• RTC battery
• Plastic case
• Power adapter

• SoC: Intel(R) Atom(TM) x5 Z8350 Processor 64-bit - up to 1.92 GHz
• Graphics: Intel(R) HD 400 Graphics, 12 EU GEN 8, up to 500 MHz Support DX*11.1/12,
  Open GL*4.2, Open CL*1.2 OGL ES3.0, H.264, HEVC (decode), VP8
• System memory: 4 GB DDR3L
• Storage capacity: 64 GB eMMC
• USB 2.0 external connector: 4x
• USB 2.0 port (pin header): 2x
• USB 3.0 port: 1x (OTG)
• Ethernet: 1x GB Ethernet (full speed) RJ-45
• Video output: HDMI
• Display interface: DSI/eDP
• Camera Interface: MIPI-CSI
• Power input: 5 V DC-in (at) 3 A 5.5/2.1 mm Jack
• RTC: Yes
• PXE: No
  
• WOL: Yes
• Operating humidity: 10 % ~ 80 % RH non-condensing
• Operating temperature: 32°F - 140 °F / 0 °C ~ 60 °C
• Expansion: 40 pin General Purpose bus, supported by Altera Max V. ADC 8-bit (at) 188ksos
• Compatible operating system: Microsoft Windows 10 full version, Windows IoT Core
  Linux (ubilinux, Ubuntu, Yocto); Android Lollipop; Brillo
• Certificate: CE/FCC Class A, RoHS compliant, Microsoft Azure certified
• Dimension: 3.37" x 2.22" / 85.60 mm x 56.5 mm
• Weight: 88 grams
• CEC: No