APUCOOL - APU Cooling Assembly

PC Engines apucool - APU Cooling Assembly

Please note: the heat spreader kit is included with APU boards, no need to order separately, unless you have to migrate a board to a new enclosure.

The APU CPU and south bridge (APU1) or APU2 CPU (single chip) are passively cooled by heat conduction to the bottom of the enclosure. This assumes the use of a PC Engines enclosure. Third party enclosures should work if they are made from aluminum and have a board standoff height of 5 mm.

Please avoid unnecessary disassembly, the heat conductive pads are rather fragile. Please contact us if you need replacements.

• Thickness: approx. 5 mm
• Thermal conductivity 6 W/mK or better
• Inclusive 2x thermal pads

Due to the high power density of the CPU, pads with lower thermal conductivity will not work well.