This thermal pad by Delock is suitable for heat dissipation, for example on an M.2 module. The aim of the pad is to improvethe performanceandincreasethe service life of thecomponents.

Low oil bleeding This pad has particularly low oil bleeding, which protects the electronic components and contacts from contamination and can offer a longer service life. Pads with “low oil bleeding” retain their thermal and mechanical properties better and therefore ensure even and stable heat dissipation.

Technical data
– Thermal conductive pad for heat dissipation
– Low oil bleeding
– Thermal conductivity: 3.2 W/mK
– Operating temperature: -60 °C ~ 180 °C
– Colour: grey
– Dimensions (LxWxH): approx. 70 x 20 x 1.75 mm

Package contents
– 1 x thermal conductive pad

Packaging
– Resealable bag