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UP Bridge the Gap – UP-CHT01-A20-0464-A11 – UP board with z8350 CPU, 4 GB RAM + 64 GB eMMC, passive heatsink

Original price was: 310,78 €.Current price is: 242,44 €.

UP-CHT01-A20-0464-A11 – UP board with z8350 CPU, 4 GB RAM + 64 GB eMMC, passive heatsink UP is a credit card size board with the high performance and low power consumption features of the latest tablet technology: the Intel(R) Atom(TM) x5 Z8350…

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Delivery time: 1-3 Workdays
There are only 5 pieces left in stock
SKU UP-CHT01-A20-0464-A1
EAN 4250605525644
MPN UP-CHT01-A20-0464-A11
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UP-CHT01-A20-0464-A11 – UP board with z8350 CPU, 4 GB RAM + 64 GB eMMC, passive heatsink

UP is a credit card size board with the high performance and low power consumption features of the latest tablet technology: the Intel(R) Atom(TM) x5 Z8350 processors (code name Cherry Trail) 64 bits up to 1.92 GHz. The internal GPU is the new Intel Gen 8 HD 400 with 12 Execution Units up to 500 MHz to deliver extremely high 3D graphic performance. UP is equipped with 4 GB DDR3L RAM and 64 GB eMMC.

UP has 40-pin General Purpose bus which provides the freedom to makers to build up their shield. There are more interfaces available, such as 4x port USB 2.0 on connectors, 2x port USB 2.0 + 1x UART on header, 1x USB 3.0 OTG, 1x Gbit Ethernet (full speed), 1x DSI/eDP port, 1x camera (MIPI-CSI), 1x HMDI, RTC.

When it comes to security, UP has Intel security features needed for professional IoT applications such Intel AES New Instructions and Intel Identity Protection Technology.

Its UP to you to choose which operation system is best for your application. The CPU is supported by Android 6. Marshmallow, Microsoft Windows 10 and Linux through the UP Community.

UP has a standard industrial PC operating temperature range of 32°F – 140°F/0°C – 60°C, which makes it flexible for many applications.

UP is perfect for professional makers.

  • SOC: Intel(R) Atom(TM) x5-Z8350 processor (2M cache, 1.44 GHz up to 1.92 GHz) CPU with 64 bit architecture; quad core
  • Graphics: Intel(R) HD 400 Graphics, 12 EU GEN 8, up to 500 MHz; Supports DX*11.1/12, Open GL*4.2, Open CL*1.2 OGL; ES3.0, H.264, HEVC (decode), VP8
  • Video & audio: HDMI 1.4b; I2S audio port
  • Camera interface: CSI (4 Megapixel)
  • USB 2.0: 4x USB 2.0; 2x USB 2.0 pin header (10 pins in total)
  • RTC: Yes
  • Power: 5 V DC-in (at) 4 A 5.5/2.1 mm jack
  • Dimensions: 3.37″ x 2.22″/85.60 mm x 56.5 mm
  • Operating humidity: 10% ~ 80% RH non-condensing
  • Memory: 4 GB DDR3L-1600
  • Storage capacity: 64 GB eMMC
  • Display interface: DSI/eDP
  • Ethernet: 1x Gb Ethernet (full speed) RJ-45
  • USB 3.0: 1x USB 3.0 OTG
  • Expansion: 40-pin general purpose bus, supported by Altera; Max V. ADC 8-bit (at) 188 ksos
  • Compatible operating system: Microsoft Windows 10 full version; Linux (ubilinux, Ubuntu, Yocto); Android Marshmallow
  • Operating temperature: 32°F – 140°F/0°C ~ 60°C
  • Certificate: CE/FCC Class A, RoHS compliant; Microsoft Azure certified, REACH
Weight 0,2 kg
Dimensions 13 × 8 × 4 cm
Chipset

Intel

Bluetooth

no

Memory size

64GB

memory type

DDR3L

graphic card

Intel HD 400

processor

Intel Atom x5-Z8350

hard drive typ

eMMC

scope of application

IoT

Connections

HDMI, UART, USB

type of cooling

air cooling passiv

Produkttyp

SBC / Single board Computer

Color

green

memory size

4 GB

number of hard drives installed

1

memory configuration

1 x 4GB

operating system

Ohne Betriebssystem

number of CPU cores

4

processor clock speed

1.9GHz

garaphocs memory type

shared-memory

Product safety

Manufacturer information

AAEON Technology (Europe) B.V.
Beatrix de Rijkweg 8
5657 EG Eindhoven
NL - Netherlands

E-Mail: shop@up-board.org

Person responsible for the EU

AAEON Technology (Europe) B.V.
Beatrix de Rijkweg 8
5657 EG Eindhoven
NL - Netherlands

E-Mail: shop@up-board.org

UP – Bridge the Gap is a brand that provides innovative and reliable Single-board computers (SBCs) for professional developers with the latest Intel® technology, helping them to bring their ideas to fruition. The UP team aims to bring innovation through integrated solutions for a variety of business models. Working closely with leaders across vertical markets,...